3D Visualization and Volume Analysis

In addition to microtome techniques used in SEM imaging to general 3D image stacks, FIB-SEM, focus ion beam, is another technique used in the semiconductor industry. With FIB-SEM imaging, large 3D image data sets can be rendered and viewed as 3D volumes.

In some cases, the 3D image stack must be correctly aligned before 3D volume rendering and analysis can occur. If the image planes are misaligned, critical dimension analysis may generate incorrect results. Image-Pro includes specific image stack alignment methods to correctly align the image stack.