Intermetallic Corrosion

The Intermetallic Corrosion Application is purposely built to examine electronic contact areas on IC contacts, looking for corrosion between copper ball ends and aluminum contact sites.

This application helps you identify the contact point region by drawing an ROI over it. With a set segmentation threshold, you can then identify the uncorroded aluminum.

With that information, it reports the percentage area of the ROI not containing uncorroded aluminum –that is, the percentage area covered in corrosion products.